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Hot-carrier phenomena in high temperature processed undoped-hydrogenated n-channel polysilicon thin film transistors (TFTs)

机译:高温处理的未掺杂氢化n沟道多晶硅薄膜晶体管(TFT)中的热载流子现象

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摘要

A study on hot-carrier phenomena in high temperature processed undoped and hydrogenated n-channel polysilicon thin film transistors (TFTs) is presented. First, stress conditions are determined by photon emission measurements during impact ionization condition. Next four stress regimes are performed. We distinguish two modes of stress conditions according to drain voltage during stressing: High drain voltage stress (HDVS) and low drain voltage stress (LDVS). Each of these modes gives different results when applied to our TFTs. During HDVS condition, two regimes are observed. First, hot-hole injection into the oxide occurs synchronically with interface- state generation. At a second stage, this mechanism saturates and electron injection through the polySi-SiO_2 barrier takes place with less interface states generated. In contrast, during LDVS conditions no saturation of interface-state generation is observed and two regimes of transconductance degradation appear. The distribution in the gap of the stress-induced interface states is calculated by a known method. Finally, on- and off state current stress was studied. Off-stressing affects mainly the gate oxide and is not accompanied by measurable impact ionization phenomena and thus no considerable interface-state generation.
机译:提出了高温处理的未掺杂和氢化的n沟道多晶硅薄膜晶体管中的热载流子现象的研究。首先,在碰撞电离条件下通过光子发射测量确定应力条件。接下来执行四个压力方案。我们根据应力期间的漏极电压区分两种应力状态模式:高漏极电压应力(HDVS)和低漏极电压应力(LDVS)。当将这些模式应用于我们的TFT时,每种模式都会产生不同的结果。在HDVS条件下,观察到两种状态。首先,热空穴注入氧化物与界面态产生同步发生。在第二阶段,该机制达到饱和,并且通过多晶硅-SiO_2势垒注入电子,产生的界面态更少。相比之下,在LDVS条件下,未观察到界面态产生的饱和,并且出现了两种跨导退化的情况。应力引起的界面状态的间隙中的分布通过已知方法计算。最后,研究了开关状态电流应力。偏应力主要影响栅极氧化物,并且不伴有可测量的碰撞电离现象,因此不会产生明显的界面态。

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