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The influence of post annealing on oxide charge-to- breakdown in tungsten polycide gate technology

机译:后退火对多晶钨栅极技术中氧化物电荷击穿的影响

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摘要

The dependence of QBD on the combined post annealing conditions of RTA and FA in the tungsten polycide gate technology has been experimentally investigated. In the case of RTA to be processed after FA, QBD is controlled by the amount of fluorine diffused into the oxide, and then it is decreasing as increasing RTA temperature and time. However, in the vice-versa case, QBD shows the poor characteristics because of the effect of lightly activated polysilicon. Based on these experimental results, the combined post annealing with FARTA sequence is useful to obtain the high QBD performance.
机译:通过实验研究了QBD对多晶钨栅极技术中RTA和FA组合后退火条件的依赖性。在FA之后进行RTA处理的情况下,QBD由扩散到氧化物中的氟含量控制,然后随着RTA温度和时间的增加而降低。然而,反之亦然,由于轻度活化的多晶硅的作用,QBD显示出较差的特性。根据这些实验结果,将后退火与FARTA序列结合使用对于获得高QBD性能很有用。

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