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Effect of annealing on electrical properties of Pt/β-SiC contact

机译:退火对Pt /β-SiC触头电性能的影响

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The property of contacts on semiconductors, which are deposited and annealed in high temperatures, is significantly affected by the annealing condition. SiC is one of the most attractive semiconductors applied in high temperature devices. In this study, the possibility of Pt being used as Schottky contact on SiC was examined by investigating the effects of annealing on the electrical properties of Pt/β-SiC contact. The as-deposited Pt-type β-SiC contacts showed ohmic property, which is attributed to the donor-like traps at the interface due to the sputtering damage. On the other hand, after annealing the contacts showed Schottky property, which seems to be originated from the annealing of traps and the movement of the junction into the defect-free SiC film during annealing. The barrier height increased with increasing annealing temperature, showing 1.37 eV at the annealing temperature of 900℃.
机译:在高温下沉积和退火的半导体触点的性能受退火条件的影响很大。 SiC是应用于高温设备的最具吸引力的半导体之一。在这项研究中,通过研究退火对Pt /β-SiC接触电性能的影响,研究了将Pt用作SiC上的肖特基接触的可能性。沉积后的Pt / n型β-SiC触点显示出欧姆特性,这归因于由于溅射损伤而在界面处的施主状陷阱。另一方面,在退火之后,触点显示出肖特基性质,这似乎是由于陷阱的退火以及在退火过程中结向无缺陷SiC膜中的运动所致。势垒高度随退火温度的升高而增加,在900℃的退火温度下势垒高度为1.37 eV。

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