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Temperature dependence of forward current characteristics of GaN junction and Schottky rectifiers

机译:GaN结和肖特基整流器的正向电流特性与温度的关系

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A comparison was made of the forward current-voltage characteristics of bulk GaN Schottky and p-n junction rectifiers using a quasi-three-dimensional simulator. The model includes incomplete ionization of the deep Mg acceptor (175 meV) in the p~+-GaN side of the junction and the temperature dependence of mobility and GaN band gap. The forward turn-on voltages, V_F, decrease with increasing temperature for both types of rectifier and are ~2.5 V at 100 Acm~(-2) at 573 K for the junction diodes and ≤ 1 V under similar conditions for the Schottky diodes. The effect of p-layer thickness and doping in the p-n junction was also investigated.
机译:使用准三维仿真器对块状GaN肖特基和p-n结整流器的正向电流-电压特性进行了比较。该模型包括结的p〜+ -GaN侧的深Mg受体(175 meV)的不完全电离,以及迁移率和GaN带隙的温度依赖性。对于两种类型的整流器,正向导通电压V_F均随温度的升高而降低,对于结型二极管,在573 K时,在100 Acm〜(-2)时,正向导通电压为〜2.5 V,在肖特基二极管的相似条件下,正向导通电压为V≤1V。还研究了p层厚度和p-n结中掺杂的影响。

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