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Impact of parasitic elements on the performance of digital CMOS circuits with Gigabit feature size

机译:寄生元件对具有千兆位特征尺寸的数字CMOS电路性能的影响

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This paper discusses the impact of the interconnect parameters on the signal delay of digital CMOS circuits. The minimum feature size for simulated MOSFETs was scaled in the range from 100 to 10 nm and interconnects were scaled down to 25 nm feature size. Our results show that new parasitic effects, as the size effect for copper and the increase of the threshold voltage due to direct tunneling gate current, will partly compensate the performance gain obtained by using new materials. These effects must be considered for minimum feature sizes below 50 nm. The influences have been studied on a logical unit and on on-chip interconnect scheme.
机译:本文讨论了互连参数对数字CMOS电路信号延迟的影响。模拟MOSFET的最小特征尺寸在100到10 nm的范围内缩放,而互连缩小到25 nm的特征尺寸。我们的结果表明,新的寄生效应,如铜的尺寸效应和由于直接隧穿栅极电流引起的阈值电压的增加,将部分补偿使用新材料获得的性能增益。对于小于50 nm的最小特征尺寸,必须考虑这些影响。已经研究了对逻辑单元和片上互连方案的影响。

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