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首页> 外文期刊>Solid-State Electronics >Si doped p- and n-type Al_xGa_(1-x)As epilayers for high density lateral-junction LED arrays on (311)A patterned substrate
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Si doped p- and n-type Al_xGa_(1-x)As epilayers for high density lateral-junction LED arrays on (311)A patterned substrate

机译:硅掺杂的p型和n型Al_xGa_(1-x)As外延层,用于(311)A图案化衬底上的高密度横向结LED阵列

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摘要

The controlled incorporation of amphoteric Si dopant for p- and n- type conductivity in Al_xGa_(1-x).As layers simultaneously grown on GaAs (311)A and (100) substrates by molecular beam epitaxy (MBE) was investigated for different Al compositions. (10-50%). The optimized growth conditions have been used to grow lateral junction (LJ) light emitting diodes (LEDs) structures on GaAs (3 11)A patterned substrate. High density (2400 device per inch) LJ-LED arrays were successfully fabricated. The electroluminescence spectrum shows a single peak around 813 nm at room temperature.
机译:为控制Al_xGa_(1-x)中p型和n型导电性而引入的两性Si掺杂剂。研究了通过分子束外延(MBE)在GaAs(311)A和(100)衬底上同时生长的As层成分。 (10-50%)。优化的生长条件已用于在GaAs(3 11)A图案化衬底上生长横向结(LJ)发光二极管(LED)结构。成功制造了高密度(每英寸2400器件)的LJ-LED阵列。电致发光光谱在室温下在813 nm附近显示一个峰。

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