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Low voltage and low power embedded 2T-SONOS flash memories improved by using P-type devices and high-K materials

机译:通过使用P型器件和高K材料改进了低压低功耗嵌入式2T-SONOS闪存

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摘要

16 Mb 2-transistor (2T)-SONOS flash memories have been processed in a 0.18 μm CMOS technology. The 2T NOR architecture allows fast random access and low power program and erase by tunneling. Also, negative erased threshold voltages enable low voltage read without boosting. This paper shows the operation and reliability aspects of 2T N-type SONOS memories: endurance, retention and read disturb. A further reduction in read voltage is demonstrated by using P-type SONOS and makes it even possible to operate the devices with a symmetric threshold voltage (V_T) window around 0 V. In this case, read disturb is completely avoided and the advantages of the 2T NOR architecture are fully used, meaning fast random access and real low power operation. Besides SONOS embedded flash memories, also the reliability of devices with either the top layer or trapping layer made of the high-K materials HfO_2 or HfSiON have been investigated. The memories with a high-K top layer are indicated by SHINOS (Silicon-High-K-Nitride-Oxide-Silicon). A strong gain in program/erase efficiency can be obtained for SHINOS compared with SONOS memories. The SHINOS devices show good endurance and retention. The retention of the SHINOS devices can be considerably improved by trading-off the improved program/erase efficiency with a thicker bottom oxide.
机译:16 Mb 2晶体管(2T)-SONOS闪存已采用0.18μmCMOS技术进行处理。 2T NOR架构允许快速随机访问,低功耗编程和通过隧道擦除。同样,负擦除阈值电压可实现低电压读取而无需升压。本文展示了2T N型SONOS存储器的操作和可靠性方面:耐久性,保留性和读取干扰。通过使用P型SONOS可以进一步降低读取电压,并且甚至可以在0 V左右的对称阈值电压(V_T)窗口下操作器件。在这种情况下,完全避免了读取干扰,并且具有以下优点:充分利用2T NOR架构,这意味着快速的随机访问和真正的低功耗操作。除了SONOS嵌入式闪存外,还研究了由高K材料HfO_2或HfSiON制成的顶层或陷阱层的器件的可靠性。具有高K顶层的存储器由SHINOS(硅-高K-氮化物-氧化物-硅)表示。与SONOS存储器相比,SHINOS的编程/擦除效率得到了很大的提高。 SHINOS设备显示出良好的耐久性和保持力。通过权衡提高的编程/擦除效率和更厚的底部氧化物,可以显着提高SHINOS器件的保留能力。

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