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N-channel MOSFETs fabricated on He-implanted and annealed SiGe buffer layers

机译:在He注入并退火的SiGe缓冲层上制造的N沟道MOSFET

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摘要

He-implantation and annealing is an alternative method of fabricating strain-relaxed SiGe buffer layers for applications such as strained Si MOSFETs. Here we report the characteristics of He-implanted and annealed SiGe buffer layers and the properties of n-channel MOSFETs fabricated with them. We find that the electron mobility is comparable to the value obtained from devices fabricated with graded SiGe buffer layers. The drive current is 1.8 times larger than that in bulk Si control devices and short channel MOSFETs have a low current at negative gate voltage.
机译:He注入和退火是制造应变松弛的SiGe缓冲层的另一种方法,用于诸如应变Si MOSFET的应用。在这里,我们报告了氦注入和退火的SiGe缓冲层的特性以及用它们制造的n沟道MOSFET的特性。我们发现,电子迁移率可与由渐变SiGe缓冲层制成的器件获得的值相当。该驱动电流是大体积硅控制器件的1.8倍,而短沟道MOSFET在负栅极电压下具有低电流。

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