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Improved DC and RF performance of AlGaN/GaN HEMTs grown by MOCVD on sapphire substrates

机译:通过MOCVD在蓝宝石衬底上提高的AlGaN / GaN HEMT的DC和RF性能

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摘要

High-quality AlGaN/GaN high electron mobility transistor (HEMT) structures were grown by metalorganic chemical vapor deposition (MOCVD) on 2-in. sapphire substrates. Two-dimensional electron gas (2DEG) mobility of 1410 cm~2/V s and concentration of 1.0 x 10~(13) cm~(-2) are obtained at 295 K from the HEMT structures, whose average sheet resistance and sheet resistance uniformity are measured to be about 395 Ω/sq and 96.65% on 2-in. wafers, respectively. AlGaN/GaN HEMTs with 0.8 μm gate length and 0.2 mm gate width were fabricated and characterized using the grown HEMT structures. Maximum current density of 0.9 A/ mm, peak extrinsic transconductance of 290 mS/mm, unity cutoff frequency (f_T) of 20 GHz and maximum oscillation frequency (f_(max)) of 46 GHz are achieved. These results represent significant improvements over the previously fabricated devices with the same gate length, which are attributed to the improved performances of the MOCVD-grown HEMT structures.
机译:通过金属有机化学气相沉积(MOCVD)在2英寸上生长出高质量的AlGaN / GaN高电子迁移率晶体管(HEMT)结构。蓝宝石衬底。由HEMT结构在295 K处获得二维电子气(2DEG)迁移率1410 cm〜2 / V s和浓度1.0 x 10〜(13)cm〜(-2),其平均薄层电阻和薄层电阻2英寸的均匀度约为395Ω/ sq和96.65%。晶片。使用生长的HEMT结构制造并表征了栅极长度为0.8μm,栅极宽度为0.2 mm的AlGaN / GaN HEMT。实现了0.9 A / mm的最大电流密度,290 mS / mm的峰值非本征跨导,20 GHz的单位截止频率(f_T)和46 GHz的最大振荡频率(f_(max))。这些结果表明,与以前制造的具有相同栅极长度的器件相比,有了显着改进,这归因于MOCVD生长的HEMT结构的性能提高。

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