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Sampling calibration of ion implantation profiles in crystalline silicon from 0.1 to 300 keV using Monte Carlo simulations

机译:使用蒙特卡洛模拟从0.1到300 keV的晶体硅中离子注入剖面的采样校准

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摘要

In this work, we study previously published Pearson models in amorphous silicon and present an improved Pearson IV model of ion implantation as a function of implant energy and crystal orientation for use in crystalline silicon. The first 4 moments of the Pearson IV distribution have been extracted from impurity profiles obtained from the Binary Collision Approximation (BCA) code, Crystal TRIM for a wide energy range 0.1-300 keV at varying tilts and rotations. By comparisons with experimental data, we show that certain amounts of channelling always occur in crystalline targets and the analytical Pearson technique should be replaced by a more robust method. We propose an alternative model based on sampling calibration of profiles and present implant tables that has been assimilated in the process simulator DIOS. Two-dimensional impurity profiles can be subsequently generated from these one-dimensional profiles when the lateral standard deviation is specified.
机译:在这项工作中,我们研究了以前发表的非晶硅中的Pearson模型,并提出了一种用于离子注入的改进Pearson IV模型,该模型是用于晶体硅的注入能量和晶体取向的函数。 Pearson IV分布的前4个矩是从在二进制倾斜碰撞(BCA)代码,晶体TRIM中获得的杂质分布中提取的,该杂质在变化的倾斜和旋转下具有0.1-300 keV的宽能范围。通过与实验数据进行比较,我们显示出一定数量的通道总是在结晶靶中发生,并且分析皮尔逊技术应被更可靠的方法所代替。我们提出了一种基于轮廓和当前植入物表的采样校准的替代模型,该模型已在过程模拟器DIOS中进行了吸收。当指定了横向标准偏差时,随后可以从这些一维轮廓生成二维杂质轮廓。

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