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Fringe-induced barrier lowering (FIBL) included threshold voltage model for double-gate MOSFETs

机译:边缘感应势垒降低(FIBL)包括用于双栅MOSFET的阈值电压模型

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A physical, compact, short-channel threshold voltage model for undoped double-gate MOSFETs has been extended through a phenomenological approach to include the fringe-induced barrier lowering (FIBL) effect associated with high-permittivity (high-k) gate dielectrics. The resulting analytical model closely describes published numerical simulations over a wide range of device/material parameters. Exploiting the new device model, a concerted analysis combining FIBL-enhanced short-channel effects and gate direct tunneling current is performed on candidate high-k gate dielectrics to assess their overall impact on DG MOSFET scaling. It is projected that high-k gate dielectrics may extend DG MOSFET scaling beyond that with SiO_2 by 10-20% for a 2-3x smaller equivalent oxide thickness of high-k dielectrics than that of SiO_2.
机译:未掺杂双栅极MOSFET的物理,紧凑,短通道阈值电压模型已通过现象学方法得到扩展,包括与高介电常数(high-k)栅极电介质相关的条纹感应势垒降低(FIBL)效应。所得的分析模型密切描述了已发布的有关各种设备/材料参数的数值模拟。利用新的器件模型,对候选高k栅极电介质进行了结合FIBL增强的短沟道效应和栅极直接隧穿电流的协同分析,以评估它们对DG MOSFET缩放的总体影响。预计高k介电层的等效氧化物厚度比SiO_2小2-3倍时,高k栅电介质可以使DG MOSFET的尺寸扩展超出SiO_2的10-20%。

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