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Low temperature characterization of effective mobility in uniaxially and biaxially strained nMOSFETs

机译:单轴和双轴应变nMOSFET中有效迁移率的低温表征

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摘要

In this paper, a detailed investigation of the mobility in two different strained-Si technologies has been conducted. The mobility gain due to strain is nearly lost in short channel devices. The short channel loss observed in both cases is attributed to a bigger contribution of Coulomb scattering and to a larger subband splitting due to pocket implants. Finally, the mobility gain reduction with temperature lowering has been quantitatively interpreted by a simple analytical model accounting for the fourfold valley depopulation and considering different scattering rates for the two first subbands.
机译:在本文中,已经对两种不同的应变硅技术中的迁移率进行了详细的研究。由于应变导致的迁移率增益在短通道设备中几乎消失了。在两种情况下观察到的短通道损耗均归因于库仑散射的较大贡献以及归因于口袋注入的较大子带分裂。最后,通过一个简单的分析模型定量解释了随温度降低的迁移率增益降低,​​该模型考虑了四倍的山谷人口减少情况,并考虑了两个第一子带的不同散射率。

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