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An improved substrate current model for ultra-thin gate oxide MOSFETs

机译:用于超薄栅极氧化物MOSFET的改进衬底电流模型

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In existing substrate current I_(sub) models for short channel MOSFETs, the new model of the characteristic ionization length l or the velocity saturation region length L_d has been developed by using the polynomial fitting method in order to represent the variation of maximum electric field E_m with bias voltages in channel. This work proposes a bias-voltage- and gate-length-dependent parameter η which was previously treated as a process-dependent constant, aimed at obtaining an accurate expression of E_m to increase the accuracy of I_(sub) model for ultra-deep submicron devices with ultra-thin gate oxides. This new method overcomes the complicated modeling of characteristic ionization length l, and avoids the extractions of different fitting constant η corresponding to different devices. It also warrants the unique extraction of impact ionization coefficients A_i and B_i. Compared with some existing I_(sub) models, the improved one presents more excellent agreements with the experiments of ultra-thin gate oxide (t_(ox) = 1.24 nm) LDD NMOSFETs on 90 nm CMOS technology, especially in the high electric field region. Meanwhile, the new I_(sub) model accurately simulates the shift of the peak of substrate current along the gate bias axis with the shortening of gate length which usually occurs in ultra-thin gate oxide devices, helpful to the lifetime prediction of sub-100 nm devices.
机译:在现有的用于短沟道MOSFET的衬底电流I_(sub)模型中,已经通过使用多项式拟合方法开发了特征电离长度l或速度饱和区域长度L_d的新模型,以表示最大电场E_m的变化。通道中带有偏置电压。这项工作提出了偏置电压和栅极长度相关的参数η,该参数先前被视为与过程相关的常数,旨在获得E_m的精确表达式,以提高超深亚微米I_(sub)模型的准确性。具有超薄栅极氧化物的器件。该新方法克服了特征化电离长度l的复杂建模,并且避免了提取对应于不同设备的不同拟合常数η。它还保证了碰撞电离系数A_i和B_i的唯一提取。与某些现有的I_(sub)模型相比,改进后的模型与基于90 nm CMOS技术的超薄栅极氧化物(t_(ox)= 1.24 nm)LDD NMOSFET的实验(在高电场区域中)表现出更加出色的一致性。同时,新的I_(sub)模型可以精确模拟衬底电流峰值沿栅极偏置轴的偏移,而栅极长度的缩短通常发生在超薄栅极氧化物器件中,这有助于sub-100的寿命预测纳米器件。

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