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Effective temperature measurements of AlGaN/GaN-based HEMT under various load lines using micro-Raman technique

机译:使用微拉曼技术在各种负载线下有效测量AlGaN / GaN基HEMT的温度

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摘要

We report on contact-free measurement of channel temperature of AlGaN/GaN HEMTs under different operation modes. Micro-Raman spectroscopy was successfully used to measure the temperature of operating HEMT devices with < 1 μm spatial resolution. Channel temperatures at various load lines were compared. The effective operating temperatures of AlGaN/GaN HEMTs were accessed from the calibration curve of passively heated AlGaN/GaN structures. A linear increase of junction temperature was observed when DC dissipated power was increased. The temperature of the center of the channel in the HEMT was higher than that near the edge by ~30℃ at 800 mW DC power. The temperature range of class A operation mode is higher than that of class B operation mode. The operating device reached temperatures as high as 115℃ at 800 mW DC input power.
机译:我们报告了在不同操作模式下AlGaN / GaN HEMT的沟道温度的无接触测量。显微拉曼光谱法已成功用于测量空间分辨率小于1μm的HEMT设备的温度。比较了各种负载线的通道温度。从被动加热的AlGaN / GaN结构的校准曲线可以得出AlGaN / GaN HEMT的有效工作温度。当直流耗散功率增加时,观察到结温线性增加。在800 mW直流功率下,HEMT中通道中心的温度比边缘附近的温度高约30℃。 A类操作模式的温度范围高于B类操作模式的温度范围。在输入功率为800 mW的情况下,操作设备的温度高达115℃。

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