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A numerical study of field plate configurations in RF SOI LDMOS transistors

机译:射频SOI LDMOS晶体管场板配置的数值研究

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The effect of the source field plate architecture on the static and dynamic electrical performances of SOI LDMOS transistors for RF applications is analysed in this paper. Three architectures are envisaged: source field plate SFP, extended gate field plate and independently biased field plate. Moreover, two different drift diffusion profiles are considered: shallow SDD and deep doped DDD diffusion. The resultant drift region is analytically modelled and the impact of geometrical and technological parameters on the transconductance value is determined by means of numerical simulation techniques. Finally, the dependence of the LDMOS capacitances on the field plate configuration is also studied. Simulation results show the trade-off between reliability and transconductance in each field plate configuration. In spite of the power efficiency improvement, the field plate biasing can significantly degrade the SOI LDMOS performances due to hot-carrier and self-heating effects. On the contrary, the SFP configuration leads to an enhanced reliability at the cost of the on-state resistance increase. The SFP structure with deep doped drift (DDD) diffusion provides the best performances in terms of cut-off frequency and self-heating degradation.
机译:本文分析了源极场板架构对用于RF应用的SOI LDMOS晶体管的静态和动态电性能的影响。设想了三种架构:源极场板SFP,扩展栅极场板和独立偏置的场板。此外,考虑了两种不同的漂移扩散曲线:浅SDD和深掺杂DDD扩散。对最终的漂移区进行了解析建模,并通过数值模拟技术确定了几何和工艺参数对跨导值的影响。最后,还研究了LDMOS电容对场板配置的依赖性。仿真结果显示了每种场板配置中可靠性和跨导之间的权衡。尽管功率效率有所提高,但由于热载流子和自热效应,场板偏置仍会严重降低SOI LDMOS性能。相反,SFP配置导致以导通电阻增加为代价的增强的可靠性。具有深掺杂漂移(DDD)扩散的SFP结构在截止频率和自热降级方面提供了最佳性能。

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