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首页> 外文期刊>Solid-State Electronics >Front- and back-channel mobility in ultrathin SOI-MOSFETs by front-gate split CV method
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Front- and back-channel mobility in ultrathin SOI-MOSFETs by front-gate split CV method

机译:前栅极分裂CV方法在超薄SOI-MOSFET中的前沟道和后沟道迁移率

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The carrier mobility in ultrathin SOI MOSFETs with thin SiO_2 gate oxide is investigated by comparing the front and back channels. The front-gate split CV method is used at large substrate voltages to determine the carrier density and mobility in the back channel. The implementation of the split CV technique in ultrathin SOI films is described. This method is also efficient for determining the threshold voltage of the back channel. The accuracy as well as the limitations of the technique are discussed. Systematic experiments are presented for advanced n-channel and p-channel SOI MOSFETs. The results confirm that the mobility in the front channel is smaller than that in the back channel.
机译:通过比较前沟道和后沟道,研究了具有薄SiO_2栅氧化物的超薄SOI MOSFET中的载流子迁移率。在较大的基板电压下使用前栅极分裂CV方法来确定背道中的载流子密度和迁移率。描述了在超薄SOI膜中实现分体CV技术的方法。该方法对于确定反向通道的阈值电压也是有效的。讨论了该技术的准确性和局限性。提出了针对高级n沟道和p沟道SOI MOSFET的系统实验。结果证实,前通道中的迁移率小于后通道中的迁移率。

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