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The impact of post gate annealing on microwave noise performance of AlGaN/GaN HEMTs

机译:栅后退火对AlGaN / GaN HEMTs微波噪声性能的影响

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摘要

The effects of post gate annealing on microwave noise performance of AlGaN/GaN HEMTs on SiC substrate were investigated. The results show that post Schottky gate annealing under an optimized condition, 400℃ for 10 min in N_2 ambient, can increase the current driving capability, reduce gate leakage current, and improve the microwave noise performance. Specifically, the maximum extrinsic transconductance increased from 223 mS/mm to 233 mS/mm. The 1 mA/mm gate leakage current at V_(gs) = - 30 V reduced to 4 nA/ mm. Before annealing, the device exhibited a minimum noise figure of 0.99 dB at 4 GHz. It decreased to 0.63 dB and the associated gain increased from 13.2 dB to 17.4 dB at the mean time. The change is even more significant under high current operation. At 4 GHz, the 4.90 dB NF_(min) at I_(ds) of 670 mA/mm decreased more than 3 dB to 1.12 dB. Based on a simple noise model, the improvement of the microwave noise performance is attributed to the significant decrease of the gate leakage current.
机译:研究了栅后退火对SiC衬底上AlGaN / GaN HEMT的微波噪声性能的影响。结果表明,在最佳条件下于N_2气氛中400℃进行肖特基栅极后退火10 min,可以提高电流驱动能力,降低栅极漏电流,改善微波噪声性能。具体来说,最大非本征跨导从223 mS / mm增加到233 mS / mm。 V_(gs)=-30 V时的1 mA / mm栅极泄漏电流降至4 nA / mm。在退火之前,该器件在4 GHz处的最小噪声指数为0.99 dB。平均时它下降到0.63 dB,相关的增益从13.2 dB增加到17.4 dB。在大电流操作下,变化甚至更大。在4 GHz时,I_(ds)为670 mA / mm时的4.90 dB NF_(min)降低了3 dB以上,至1.12 dB。基于简单的噪声模型,微波噪声性能的提高归因于栅极漏电流的显着降低。

著录项

  • 来源
    《Solid-State Electronics》 |2007年第1期|p.90-93|共4页
  • 作者

    Dongmin Liu; Jaesun Lee; Wu Lu;

  • 作者单位

    Department of Electrical and Computer Engineering, The Ohio State University Columbus, 205 Dreese Laboratory, 2015 Neil Avenue, OH 43210, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 一般性问题;
  • 关键词

    microwave noise; GaN; HEMTs; annealing;

    机译:微波噪声GaN HEMT退火;

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