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Amorphous SiC as a structural layer in microbridge-based RF MEMS switches for use in software-defined radio

机译:非晶SiC作为基于微桥的RF MEMS开关中的结构层,用于软件定义的无线电

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This paper reports an effort to develop amorphous silicon carbide (a-SiC) films for use in shunt capacitor RF MEMS microbridge-based switches. The films were deposited using methane and silane as the precursor gases. Switches were fabricated using 500 nm and 300 nm-thick a-SiC films to form the microbridges. Switches made from metallized 500 nm-thick SiC films exhibited favorable mechanical performance but poor RF performance. In contrast, switches made from metallized 300 nm-thick SiC films exhibited excellent RF performance but poor mechanical performance. Load-deflection testing of unmetallized and metallized bulk micromachined SiC membranes indicates that the metal layers have a small effect on the Young's modulus of the 500 nm and 300 nm-thick SiC MEMS. As for residual stress, the metal layers have a modest effect on the 500 nm-thick structures, but a significant affect on the residual stress in the 300 nm-thick structures.
机译:本文报道了开发用于非晶电容器RF MEMS微桥开关的非晶碳化硅(a-SiC)薄膜的努力。使用甲烷和硅烷作为前驱体气体沉积薄膜。使用厚度为500 nm和300 nm的a-SiC薄膜制造开关,以形成微桥。由金属化的500 nm厚SiC薄膜制成的开关显示出良好的机械性能,但RF性能却很差。相反,由金属化的300 nm厚的SiC薄膜制成的开关表现出出色的RF性能,但机械性能较差。未金属化和金属化的块状微机械SiC膜的载荷挠度测试表明,金属层对500 nm和300 nm厚SiC MEMS的杨氏模量影响很小。至于残余应力,金属层对500 nm厚的结构有适度的影响,但对300 nm厚的结构中的残余应力有显着影响。

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