High-speed thermal analysis of high power diode arrays

摘要

This paper explores high-speed image capture as a viable approach for non-invasive thermal analysis. The ability to monitor thermal transients and obtain accurate spatial information for miniature devices is important for many lighting applications. In this study, high power optoelectronic devices are stressed, and the impact of self-heating effects is examined. Results demonstrate that these effects lead to degraded device performance, reduced efficiency, and power loss.