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Drain-to-gate field engineering for improved frequency response of GaN-based HEMTs

机译:漏极到栅极现场工程设计,可改善GaN基HEMT的频率响应

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摘要

We report on a novel approach for designing high-frequency AlGaN/GaN HEMTs based on gate-drain field engineering. This approach uses a drain-connected field controlling electrode (FCE). The devices with gate-to-FCE separation of 0.5-0.7 μm exhibit much smaller frequency behavior degradation with drain bias at least up to 30 V and yield RF gain and output power improvement up to ~2 times compared to conventional devices. These results show that the FCE is a powerful technique of improving the high-frequency, high power performance of GaN HEMTs at high drain biases.
机译:我们报告了一种基于栅漏场工程设计高频AlGaN / GaN HEMT的新颖方法。这种方法使用漏极连接的场控制电极(FCE)。栅极至FCE间距为0.5-0.7μm的器件与常规器件相比,其频率特性下降幅度要小得多,其漏极偏置至少高达30 V,并且RF增益和输出功率提高高达约2倍。这些结果表明,FCE是一种在高漏极偏置下改善GaN HEMT的高频,高功率性能的强大技术。

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