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Thermionic field emission at electrodeposited Ni-Si Schottky barriers

机译:电沉积Ni-Si肖特基势垒的热电子场发射

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摘要

Current transport at Schottky barriers is of particular interest for spin injection and detection in semiconductors. Here, electrodeposited Ni-Si contacts are fabricated and the transport mechanisms through the formed Schottky barrier are studied. Highly doped Si is used to enable tunneling currents. 1-V, C-V and low-temperature 1-V measurements are performed and the results are interpreted using tunneling theory for Schottky barriers and recent models for spatially distributed barrier heights. It is shown that, contrary to the case of lowly doped Si where thermionic emission dominates, tunneling is the dominant mechanism for reverse and low forward bias for highly doped Si. An exponential reverse bias 1-V behavior with negative temperature coefficient is reported. An explanation can be found on the rapid decrease of the reverse bias 1-V slope with temperature predicted by Padovani and Stratton for thermionic field emission in conjunction with the increase of the Schottky barrier height with temperature suggested for spatially distributed barrier heights.
机译:肖特基势垒的电流传输对于半导体中的自旋注入和检测尤为重要。在此,制造了电沉积的Ni-Si触点,并研究了通过形成的肖特基势垒的传输机理。高掺杂硅用于启用隧道电流。执行1-V,C-V和低温1-V测量,并使用肖特基势垒的隧穿理论和空间分布势垒高度的最新模型来解释结果。结果表明,与低掺杂硅占主导地位的情况相反,其中低离子掺杂占主导地位,而隧穿是高掺杂硅反向和低正向偏压的主要机制。报告了具有负温度系数的指数反向偏置1-V行为。可以找到一种解释,即随着Padovani和Stratton预测温度的升高,热电子场发射的反向偏置1-V斜率会随着温度的快速下降而增加,而肖特基势垒高度则随着空间分布势垒高度的升高而升高。

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