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Phase Change Memory Cell Based On Sb_2te_3/tin/ge_2sb_2te_5 Sandwich-structure

机译:基于Sb_2te_3 / tin / ge_2sb_2te_5夹心结构的相变存储单元

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摘要

Four nm thick TiN film was inserted between Sb_2Te_3 and Ge_2Sb_3Te_5 films in conventional doublelayer phase change memory cell. The novel sandwich-structure phase change memory cell was still able to show triple level data storage ability. Interdiffusion between Sb_2Te_3 and Ge_2Sb_2Te_5 films is suppressed by this TiN layer. Compared with conventional doublelayer phase change memory cell, smooth resistance stages with more consistent resistance magnitudes and better data endurance characteristics of all resistance states have been achieved on the sandwich-structure phase change memory cell.
机译:在传统的双层相变存储单元中,在Sb_2Te_3和Ge_2Sb_3Te_5膜之间插入了四纳米厚的TiN膜。新型的夹层结构相变存储单元仍然能够显示三级数据存储能力。该TiN层抑制了Sb_2Te_3和Ge_2Sb_2Te_5膜之间的相互扩散。与常规的双层相变存储单元相比,在夹层结构相变存储单元上实现了具有更一致的电阻幅度和所有电阻状态的更好数据耐久特性的平滑电阻级。

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