机译:用于40 nm低功耗CMOS技术的超薄DPN STI SiON衬垫
Institute of Microelectronics & Department of Electrical Engineering, Center for Micro/Nano Science and Technology, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 70101, Taiwan;
Institute of Microelectronics & Department of Electrical Engineering, Center for Micro/Nano Science and Technology, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 70101, Taiwan;
Department of Electrical Engineering, National Yunlin University of Science and Technology, Touliu 640, Taiwan;
Institute of Microelectronics & Department of Electrical Engineering, Center for Micro/Nano Science and Technology, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 70101, Taiwan;
United Microelectronics Corporation, Tainan Science-Based Industrial Park, Tainan 74145, Taiwan;
United Microelectronics Corporation, Tainan Science-Based Industrial Park, Tainan 74145, Taiwan;
STI; SiON; DPN; ISSG; Vcc_min; 6T-SRAM;
机译:超薄ALD HfSiON覆盖层在SiON介电材料上针对低功耗应用的Ni-FUSI CMOS技术的应用
机译:具有低LO功率的$ D $-带低功耗增益提升的上变频混频器,采用40 nm CMOS技术
机译:低于100nm CMOS技术的无反冲氧工艺对1.5nm SiON栅极电介质的影响
机译:适用于低功耗SoC应用的28nm poly / SiON CMOS技术
机译:采用CMOS 0.18毫米技术的12位,40 msamples / s,低功耗,低面积流水线模数转换器。
机译:用于汽车压力和温度复合传感器的信号调理IC中采用180 Nm CMOS技术的低功耗小面积符合AEC-Q100标准的SENT发送器的设计
机译:在40 nm CMOS技术中使用皮秒脉冲激光激发D触发器的SEU灵敏度和建模