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Titanium and silver contacts on thermally oxidized titanium chip: Electrical and gas sensing properties

机译:热氧化钛芯片上的钛和银触点:电和气敏特性

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Ti-TiO_2 structure has been utilized in the fabrication of many TiO_2-based devices such as solar cells, elec-trocatalytic electrodes and noble metal-TiO_2-Ti chemical sensors. While the ohmic behaviour of Ti-TiO_2 is assumed in the description of many TiO_2-based devices, direct experimental evaluation has not yet been carried out. We have fabricated Ti-TiO_2-Ti and Ag-TiO_2-Ti structures on a thermally oxidized titanium chip and assessed their electronic behaviours at different biasing, thermal and atmospheric conditions. The junction areas at the opposite sides of the Ti-TiO_2-Ti structure were different and the linearity of the Ⅰ-Ⅴ characteristics of the structure, at both biasing directions, approved the ohmicity assumed. This was compared to the behaviour of Ag-TiO_2 junction which varied from a high energy barrier Schottky diode to an ohmic contact, depending on the composition of the surrounding atmosphere. It was established that the ionic current due to the field assisted silver ion migration in the forward biased device causes the behaviour of the Ag-TiO_2 junction to deviate from that of a Schottky diode.
机译:Ti-TiO_2结构已被用于制造许多基于TiO_2的器件,例如太阳能电池,电催化电极和贵金属TiO_2-Ti化学传感器。尽管在许多基于TiO_2的器件的描述中假定了Ti-TiO_2的欧姆行为,但尚未进行直接的实验评估。我们已经在热氧化钛芯片上制造了Ti-TiO_2-Ti和Ag-TiO_2-Ti结构,并评估了它们在不同的偏压,热和大气条件下的电子行为。 Ti-TiO_2-Ti结构相对两侧的结区不同,并且该结构的Ⅰ-Ⅴ特性在两个偏置方向上的线性都证明了其欧姆性。可以将其与Ag-TiO_2结的行为进行比较,该结从高能垒肖特基二极管变为欧姆接触,具体取决于周围大气的组成。已经确定,由于电场辅助的银离子在正向偏置器件中的迁移而产生的离子电流会导致Ag-TiO_2结的行为偏离肖特基二极管的行为。

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