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III-V tri-gate quantum well MOSFET: Quantum ballistic simulation study for 10 nm technology and beyond

机译:III-V三栅量子阱MOSFET:针对10 nm及更高技术的量子弹道仿真研究

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In this work, quantum ballistic simulation study of a III-V tri-gate MOSFET has been presented. At the same time, effects of device parameter variation on ballistic, subthreshold and short channel performance is observed and presented. The ballistic simulation result has also been used to observe the electrostatic performance and Capacitance-Voltage characteristics of the device. With constant urge to keep in pace with Moore's law as well as aggressive scaling and device operation reaching near ballistic limit, a full quantum transport study at 10 nm gate length is necessary. Our simulation reveals an increase in device drain current with increasing channel cross-section. However short channel performance and subthreshold performance get degraded with channel cross-section increment. Increasing device cross-section lowers threshold voltage of the device. The effect of gate oxide thickness on ballistic device performance is also observed. Increase in top gate oxide thickness affects device performance only upto a certain value. The thickness of the top gate oxide however shows no apparent effect on device threshold voltage. The ballistic simulation study has been further used to extract ballistic injection velocity of the carrier and ballistic carrier mobility in the channel. The effect of device dimension and gate oxide thickness on ballistic velocity and effective carrier mobility is also presented. (C) 2015 Elsevier Ltd. All rights reserved.
机译:在这项工作中,已经提出了III-V三栅MOSFET的量子弹道仿真研究。同时,观察并提出了器件参数变化对弹道,亚阈值和短通道性能的影响。弹道仿真结果也已用于观察器件的静电性能和电容电压特性。为了不断与摩尔定律保持一致,并积极进行缩放,使器件操作达到弹道极限,迫切需要在10 nm的栅极长度上进行完整的量子传输研究。我们的仿真显示,随着沟道横截面的增加,器件漏极电流也会增加。但是,短通道性能和亚阈值性能会随着通道横截面的增加而降低。增大器件横截面会降低器件的阈值电压。还观察到栅极氧化物厚度对弹道器件性能的影响。顶部栅极氧化物厚度的增加仅会影响器件性能,直至达到某个值。但是,顶栅氧化物的厚度对器件阈值电压没有明显影响。弹道仿真研究已进一步用于提取航母的弹道注入速度和弹道中的弹道载流子迁移率。还介绍了器件尺寸和栅氧化层厚度对弹道速度和有效载流子迁移率的影响。 (C)2015 Elsevier Ltd.保留所有权利。

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