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Power detectors for integrated microwave/mm-wave imaging systems in mainstream silicon technologies

机译:主流硅技术中用于集成微波/毫米波成像系统的功率检测器

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摘要

This paper analyzes and compares three different types of detectors, including CMOS power detectors, bipolar power detectors, and super-regenerative detectors, deployed in the literature for integrated microwave/mm-wave imaging systems in mainstream silicon technologies. Each detector has unique working mechanism and demonstrates different behavior with respects to bias conditions, input signal power, as well as bandwidth responses. Two Figure-of-Merits for both wideband and narrowband imaging have been defined to quantify the detector performance comparison. CMOS and Bipolar detectors are good for passive imaging, while super regenerative detectors are superior for active imaging. The analytical results have been verified by both simulation and measurement results. These analyses intend to provide design insights and guidance for integrated microwave/ mm-wave imaging power detectors. (C) 2016 Elsevier Ltd. All rights reserved.
机译:本文分析并比较了三种不同类型的检测器,包括CMOS功率检测器,双极功率检测器和超再生检测器,它们已在文献中用于主流硅技术中的集成微波/毫米波成像系统。每个检测器都有独特的工作机制,并在偏置条件,输入信号功率以及带宽响应方面表现出不同的行为。已经定义了宽带和窄带成像的两个品质因数,以量化检测器性能比较。 CMOS和双极检测器适用于被动成像,而超再生检测器则适用于主动成像。分析结果已通过仿真和测量结果验证。这些分析旨在为集成的微波/毫米波成像功率检测器提供设计见解和指导。 (C)2016 Elsevier Ltd.保留所有权利。

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