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首页> 外文期刊>Solid-State Electronics >Study on the electrical degradation of AlGaN/GaN MIS-HEMTs induced by residual stress of SiNX passivation
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Study on the electrical degradation of AlGaN/GaN MIS-HEMTs induced by residual stress of SiNX passivation

机译:SiNX钝化残余应力引起的AlGaN / GaN MIS-HEMTs电降解的研究

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摘要

In this paper, we report a new phenomenon in C-V measurement of different gate length MIS-HEMTs, which can be associated with traps character of the AIGaN/GaN interface. The analysis of DC measurement, frequency dependent capacitance-voltage measurements and simulation show that the stress from passivation layer may induce a decrease of drain output current I-ds, an increase of on-resistance, serious nonlinearity of transconductance g(m), and a new peak of C-V curve. The value of the peak is reduced to zero while the gate length and measure frequency are increasing to 21 mu m and 1 MHz, respectively. By using conductance method, the SiNx/GaN interface traps with energy level of E-c-0.42 eV to E-c-0.45 eV and density of 3.2 x 10(12) similar to 5.0 x 10(12) eV(-1) cm(-2) is obtained after passivation. According to the experimental and simulation results, formation of the acceptor-like traps with concentration of 3 x 10(11)cm(-2) and energy level of E-c-037 eV under the gate on AIGaN barrier side of AIGaN/GaN interface is the main reason for the degradation after the passivation. (C) 2017 Published by Elsevier Ltd.
机译:在本文中,我们报告了在不同栅极长度的MIS-HEMT的C-V测量中出现的一种新现象,该现象可能与AIGaN / GaN界面的陷阱性质有关。直流测量,频率相关的电容电压测量和仿真分析表明,钝化层产生的应力可能会导致漏极输出电流I-ds减小,导通电阻增加,跨导g(m)严重非线性和CV曲线的新峰值。当栅极长度和测量频率分别增加到21μm和1 MHz时,峰值减小为零。通过使用电导方法,SiNx / GaN界面陷阱的能级为Ec-0.42 eV至Ec-0.45 eV,密度为3.2 x 10(12),类似于5.0 x 10(12)eV(-1)cm(-2) )是钝化后获得的。根据实验和模拟结果,在AIGaN / GaN界面的AIGaN势垒侧的栅极下形成浓度为3 x 10(11)cm(-2)且能级为Ec-037 eV的受体状陷阱。钝化后降解的主要原因。 (C)2017由Elsevier Ltd.发布

著录项

  • 来源
    《Solid-State Electronics 》 |2017年第7期| 31-37| 共7页
  • 作者单位

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Peoples R China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    AlGaN/GaN metal-insulation-semiconductor high electron mobility transistors (MIS-HEMTs); Frequency dependent capacitance-voltage measurement; Residual stress; Interface traps;

    机译:AlGaN / GaN金属绝缘半导体高电子迁移率晶体管(MIS-HEMT);基于频率的电容电压测量;残余应力;界面陷阱;

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