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An algorithm to design floating field rings in SiC and Si power diodes and MOSFETs

机译:一种算法在SiC和Si电源二极管和MOSFET中设计浮野环

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摘要

Prior work on Silicon Carbide (SiC) power devices has been silent on the exact procedure to be employed for designing the Floating Field Rings (FFRs) meant for raising avalanche breakdown voltage of these devices. On the other hand, prior procedures for designing FFRs in Si devices do not work for kV range breakdown associated with SiC devices, and employ 10's of mu m long rings. We propose a systematic procedure for deriving the number and spacing of the FFRs of any ring length required for achieving an arbitrary breakdown voltage. The procedure can be adapted to implement any one of the ring spacing strategies, namely - constant, decreasing or increasing as one moves outward from the main junction. The procedure is demonstrated for the linearly increasing ring spacing case using TCAD simulations, considering 1.7-5.5 kV 4H-Silicon Carbide devices and a 700 V Si device reported in literature. The FFR structures resulting from our procedure are found to have a total length which is 24.5-75% of that published in literature, and breakdown voltage which is more than 92% of the plane parallel value.
机译:在碳化硅(SiC)功率器件上的事先工作已经沉默于用于设计浮田环(FFR)的精确程序,以便为这些装置提高雪崩击穿电压。另一方面,在SI器件中设计FFR的先前程序不适用于与SIC器件相关联的KV范围击穿,并使用10个MU M长环。我们提出了一种系统的程序,用于导出实现任意击穿电压所需的任何环长度的FFR的数量和间隔。该程序可以适于实现环间距策略,即 - 常数,减小或增加,因为从主结的向外移动。考虑到1.7-5.5 kV 4h-碳化硅器件和文献中报告的700V SI器件,对使用TCAD模拟进行线性增加的环间距案例进行了说明的程序。我们的程序产生的FFR结构具有总长度,该总长度为于文献中发表的24.5-75%,并且击穿电压超过平面平行值的92%。

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