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首页> 外文期刊>Solid-State Electronics >Low power-high speed performance of 8T static RAM cell within GaN TFET, FinFET, and GNRFET technologies - A review
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Low power-high speed performance of 8T static RAM cell within GaN TFET, FinFET, and GNRFET technologies - A review

机译:GaN TFET,FinFET和GNRFET技术中的8T静态RAM单元的低功耗-高速性能-评论

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摘要

Recent ULSI technology development emphasizes both silicon and graphene-based devices and system performance in terms of their low power and high switching speed. With Moore's law scaling having reached the limits of physics due to ballistic effects, efforts are moving towards nano scale materials and devices such as TFETs and GNRFETs. Still, recent developments with 7 nm lithography-based silicon devices have cited exciting results. The successful development of FinFET devices in integrated systems has been a breakthrough for the semiconductor industry. Research efforts were emphasized for new nanoscale materials such as Graphene, GaN, and Carbon nanotubes, as alternative devices for ULSI integrated system design. This paper provides a cumulative review for these three nanoscale devices: FinFET, TFET, and GNRFET. The study focuses on an 8T SRAM cell as geared towards low power and high-speed features that are suitable for high speed computers, wireless communications, and medical devices. The study covers device theory, models, and simulation. The study has showed evidence that the power consumption for both TFET and GNRFET -based systems features superior low power performance of a ratio 1:0.24 as taken for the Static T Cell for 20 nm scale devices. The practical model of the FinFET is verified and used by industry, while the practical model of both TFET and GNRFET are still in the prototype stage.
机译:最近的ULSI技术发展着重于基于硅和石墨烯的器件以及低功耗和高开关速度方面的系统性能。由于弹道效应,摩尔定律定标已达到物理极限,因此人们正在努力向纳米级材料和器件(例如TFET和GNRFET)迈进。尽管如此,基于7 nm光刻技术的硅器件的最新发展却引出了令人兴奋的结果。集成系统中FinFET器件的成功开发是半导体行业的突破。强调了对新的纳米级材料(例如石墨烯,GaN和碳纳米管)的研究工作,以作为ULSI集成系统设计的替代设备。本文提供了对这三种纳米级器件的综合综述:FinFET,TFET和GNRFET。这项研究的重点是针对低功耗和高速功能的8T SRAM单元,这些单元适用于高速计算机,无线通信和医疗设备。该研究涵盖设备理论,模型和仿真。研究表明,基于TFET和GNRFET的系统的功耗均具有出色的低功耗性能,如20 nm规模的静态T单元所采用的比例为1:0.24。 FinFET的实用模型已被业界验证并使用,而TFET和GNRFET的实用模型仍处于原型阶段。

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