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A compact LDMOS DDSCR for HV ESD protections with high robustness and reliability

机译:紧凑的LDMOS DDSCR,用于HV ESD保护,具有高鲁棒性和可靠性

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The LDMOS-based silicon controlled rectifier (SCR) is commonly used in high voltage (HV) electrostatic discharge (ESD) protection due to its great current handling capability per area and HV protection ability. In this paper, an improved LDMOS-based dual direction SCR (LDMOS-DDSCR) device is designed by replacing floating N+ region with electrically-connected P+ , N+ and P+ regions to enhance its ESD robustness, which is verified in a 0.5-mu m (1p2m) 18 V HV CDMOS process. The internal mechanism of the proposed device is analyzed using two-dimension (2D) TCAD simulations, and the ESD performance is characterized by means of transmission line pulse (TLP) and very-fast TLP (VFTLP) measurements. Compared with the conventional LDMOS-DDSCR, the failure current of the compact LDMOS-DDSCR raises from 2.00 A to 4.02 A (increased by 101%), and the trigger voltage reduces from 44.28 V to 39.76 V, without sacrificing layout area. Furthermore, the TLP I-V curves of the proposed LDMOS-DDSCR are measured at different temperatures ranging from 25 degrees C to 125 degrees C, which proves its reliability and show potential use in the applications of high voltage integrated circuits.
机译:基于LDMOS的可控硅(SCR)由于其每单位面积的电流处理能力和HV保护能力而通常用于高压(HV)静电放电(ESD)保护。本文设计了一种改进的基于LDMOS的双向SCR(LDMOS-DDSCR)器件,该器件通过用电连接的P +,N +和P +区域代替浮动N +区域来增强其ESD鲁棒性,这在0.5微米的范围内得到了验证(1p2m)18 V HV CDMOS工艺使用二维(2D)TCAD仿真分析了所建议设备的内部机制,并通过传输线脉冲(TLP)和超快TLP(VFTLP)测量来表征ESD性能。与传统的LDMOS-DDSCR相比,紧凑型LDMOS-DDSCR的故障电流从2.00 A增加到4.02 A(增加101%),并且触发电压从44.28 V降低到39.76 V,而不会牺牲布局面积。此外,所提出的LDMOS-DDSCR的TLP I-V曲线是在25摄氏度至125摄氏度的不同温度下测量的,这证明了其可靠性,并显示了在高压集成电路应用中的潜在用途。

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