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Electrical properties of 4H-SiC MIS capacitors with A1N gate dielectric grown by MOCVD

机译:MOCVD生长具有AlN栅介质的4H-SiC MIS电容器的电性能

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We report on the electrical properties of the AlN/4H-SiC interface using capacitance- and conductance-voltage (CV and GV) analysis of AlN/SiC MIS capacitors. The crystalline AlN layers are made by hot wall MOCVD. CV analysis at room temperature reveals an order of magnitude lower density of interface traps at the AlN/SiC interface than at nitrided SiO2/SiC interfaces. Electron trapping in bulk traps within the AlN is significant when the MIS capacitors are biased into accumulation resulting in a large flatband voltage shift towards higher gate voltage. This process is reversible and the electrons are fully released from the AlN layer if depletion bias is applied at elevated temperatures. Current-voltage (IV) analysis reveals that the breakdown electric field intensity across the AlN dielectric is 3-4 MV/cm and is limited by trap assisted leakage. By depositing an additional SiO2 layer on top of the AlN layer, it is possible to increase the breakdown voltage of the MIS capacitors significantly without having much impact on the quality of the AlN/SiC interface.
机译:我们使用AlN / SiC MIS电容器的电容和电导电压(CV和GV)分析报告了AlN / 4H-SiC界面的电性能。结晶AlN层通过热壁MOCVD制成。室温下的CV分析表明,在AlN / SiC界面处的界面陷阱密度比在氮化SiO2 / SiC界面处的界面陷阱密度低一个数量级。当将MIS电容器偏置为累积时,会导致较大的平带电压向较高的栅极电压偏移,因此AlN内的体陷阱中的电子陷阱非常重要。如果在升高的温度下施加耗尽偏压,则该过程是可逆的,并且电子从AlN层中完全释放出来。电流-电压(IV)分析表明,穿过AlN电介质的击穿电场强度为3-4 MV / cm,并受陷阱辅助泄漏的限制。通过在AlN层的顶部沉积一个额外的SiO2层,可以显着提高MIS电容器的击穿电压,而对AlN / SiC界面的质量没有太大影响。

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