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Electronic band structures of filled tetrahedral semiconductor LiMgP and zinc-blende AlP

机译:填充四面体半导体LiMgP和亮锌AlP的电子能带结构

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The band structures of the filled tetrahedral semiconductor LiMgP and zinc-blende AIP were studied using the full potential linearized augmented plane wave method (FP-LAPW). The conduction band modifications of LiMgP, compared to its 'parent' zinc-blende analog AIP, are discussed. It was found that the conduction band valleys of LiMgP follow the X-T-L ordering of increasing energy for both alpha (Li+ near the anion) and beta(Li+ near the cation) phases, whereas AIP has the X-L-F ordering, and the differences between the direct (Gamma-Gamma) and indirect (Gamma-X) gaps decrease in the alpha and beta-LiMgP, compared to AIR The interstitial insertion of closed-shell Li+ ion is a possible method to change the direct-indirect gap nature, but the 'interstitial insertion rule' cannot be applied in predicting all conduction band modifications of LiMgP, relative to AIR The total energy calculations show the a phase to be more stable than the 0 phase for LiMgP. (c) 2005 Elsevier Ltd. All rights reserved.
机译:使用全电位线性化增强平面波方法(FP-LAPW)研究了填充的四面体半导体LiMgP和闪锌锌AIP的能带结构。与LiMgP的“母体”闪锌矿类似物AIP相比,对LiMgP的导带修饰进行了讨论。发现LiMgP的导带谷遵循XTL顺序,即α(Li +靠近阴离子)和β(Li +靠近阳离子)相的能量增加,而AIP具有XLF顺序,并且直接(与AIR相比,alpha和beta-LiMgP中的Gamma-Gamma和间接(Gamma-X)间隙减小。闭壳Li +离子的间隙插入是改变直接-间接间隙性质的一种可能方法,但“间隙“插入法则”不能应用于相对于AIR预测LiMgP的所有导带修饰。总能量计算显示,对于LiMgP,a相比0相更稳定。 (c)2005 Elsevier Ltd.保留所有权利。

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