This paper examines the influence of the static and dynamic electrothermal behavior of silicon-on-insulator (SOI) CMOS transistors on a range of primitive analog circuit cells. In addition to the more well-known self-heating close-range thermal coupling effects are also examined. Particular emphasis is given to the impact of these effects on drain current mismatch due to localized temperature differences. Dynamic electrothermal behavior in the time and frequency domains is also considered, measurements and analyses are presented for a simple amplifier stage, current mirrors, a current output D/A converter, and ring oscillators fabricated in a 0.7-/spl mu/m SOI CMOS process. It is shown that circuits which rely strongly on matching, such as the current mirrors or D/A converter, are significantly affected by self-heating and thermal coupling. Anomalies due to self-heating are also clearly visible in the small-signal characteristics of the amplifier stage. Self-heating effects are less significant for fast switching circuits. The paper demonstrates how circuit-level simulations can be used to predict undesirable nonisothermal operating conditions during the design stage.
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机译:本文研究了绝缘体上硅(SOI)CMOS晶体管的静态和动态电热行为对一系列原始模拟电路单元的影响。除了更广为人知的自热近距离热耦合效应,还进行了研究。由于局部温度差异,这些效应对漏极电流失配的影响尤为突出。还考虑了时域和频域中的动态电热行为,并针对以0.7- / spl mu / m SOI CMOS制造的简单放大器级,电流镜,电流输出D / A转换器和环形振荡器进行了测量和分析。处理。结果表明,强烈依赖匹配的电路(例如电流镜或D / A转换器)会受到自发热和热耦合的严重影响。在放大器级的小信号特性中,由于自发热引起的异常也很明显。自热效应对快速开关电路影响不大。本文演示了如何在设计阶段使用电路级仿真来预测不良的非等温运行条件。
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