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首页> 外文期刊>IEEE Journal of Solid-State Circuits >Integrated circuit technology options for RFICs-present status andfuture directions
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Integrated circuit technology options for RFICs-present status andfuture directions

机译:RFIC的集成电路技术选项-现状和未来方向

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This paper will summarize the technology tradeoffs that areninvolved in the implementation of radio frequency integrated circuitsnfor wireless communications. Radio transceiver circuits have a verynbroad range of requirements-including noise figure, linearity, gain,nphase noise, and power dissipation. The advantages and disadvantages ofneach of the competing technologies-Si CMOS and bipolar junctionntransistors (BJTs), Si/SiGe HBTs and GaAs MESFETs, PHEMTS and HBTs willnbe examined in light of these requirements
机译:本文将总结涉及用于无线通信的射频集成电路n的技术折衷。无线电收发器电路的要求范围非常广,包括噪声系数,线性度,增益,n相噪声和功耗。不会根据这些要求检查竞争技术中的每一种的优缺点-Si CMOS和双极结型晶体管(BJT),Si / SiGe HBT和GaAs MESFET,PHEMTS和HBT

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