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A fault-tolerant array processor designed for testability and self-reconfiguration

机译:容错阵列处理器,旨在实现可测试性和自我重配置

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摘要

The design of a fault-tolerant rectangular array of processing elements (PEs) is presented in which the reconfiguration is done by means of on-chip distributed logic, without the help of any external host. Spare PEs are included in every column of the array, and faulty PEs are bypassed within a column to facilitate reconfiguration in the presence of faults. Scan paths are used to enhance the testability of the array. PEs are tested locally using near-neighbor comparisons without the need of an external host. Because the interconnections between logical neighbors are short, the speed penalty for reconfiguration is very small. Any amount of redundancy can be incorporated in the array without changing the topology of the scheme or the design of the reconfiguration switches. The scheme is well suited for very large-area, high-density chips and wafer-scale integration. In order to demonstrate the capabilities of the scheme and evaluate its performance, an experimental chip consisting of a 6*4 array was designed, fabricated, and tested. Details of the design and the implementation of the chip are presented. The scheme is also analyzed for yield and area utilization for a range of array sizes and PE survival probabilities.
机译:提出了处理元件(PE)的容错矩形阵列的设计,其中通过片上分布式逻辑进行重新配置,而无需任何外部主机的帮助。备用PE包含在阵列的每一列中,有故障的PE绕过一列以促进在出现故障时进行重新配置。扫描路径用于增强阵列的可测试性。在不使用外部主机的情况下,使用近邻比较在本地测试PE。由于逻辑邻居之间的互连很短,因此重新配置的速度损失非常小。任何数量的冗余都可以并入阵列,而无需更改方案的拓扑或重新配置交换机的设计。该方案非常适合超大面积,高密度芯片和晶圆级集成。为了演示该方案的功能并评估其性能,设计,制造和测试了由6 * 4阵列组成的实验芯片。介绍了芯片的设计和实现细节。还针对一系列阵列大小和PE生存概率分析了该方案的产量和面积利用率。

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