首页> 外文期刊>Simulation >Component-Based Modelling of Thermofluid Systems for Sensor Placement and Fault Detection
【24h】

Component-Based Modelling of Thermofluid Systems for Sensor Placement and Fault Detection

机译:用于传感器放置和故障检测的热流体系统的基于组件的建模

获取原文
获取原文并翻译 | 示例
       

摘要

Modelling of thermofluid systems is complex because of the coupling of thermal and hydraulic energies. Bond graph language is a suitable tool for modelling such nonlinearmultienergy domain systems along with their control systems. Structural control properties of the system can be determined using the causal properties of bond graphs, without resorting to any formal computation. An ontology for classifying thermofluid process components is presented in this article, along with connection syntax and model validation algorithms. Then the theory for structural analysis is used to design sensor placements for observability and also for component fault detection and isolation. This study also deals with developing a bond graph–based model representation mechanism to perform structurallevel linking of submodels.The methodology developed is applied to two example systems. Simulation of process faults is used to validate the theoretically obtained fault signatures for a thermofluid system in the second example.
机译:由于热能和水能的耦合,热流体系统的建模非常复杂。键合图语言是对此类非线性多能域系统及其控制系统进行建模的合适工具。可以使用键图的因果特性来确定系统的结构控制特性,而无需借助任何形式的计算。本文介绍了用于对热流体过程组件进行分类的本体,以及连接语法和模型验证算法。然后,将用于结构分析的理论用于设计传感器放置,以实现可观察性以及组件故障的检测和隔离。这项研究还涉及开发基于键图的模型表示机制以执行子模型的结构级链接。所开发的方法应用于两个示例系统。在第二个示例中,使用过程故障的仿真来验证理论上获得的热流体系统的故障特征。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号