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Ion-milling-assisted study of defect structure of acceptor-doped HgCdTe heterostructures grown by molecular beam epitaxy

机译:离子铣削辅助研究分子束外延生长的受主掺杂的HgCdTe异质结构的缺陷结构

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摘要

The effect of ion milling on electrical properties of vacancy- and arsenic-doped p-Hg_(1-x)Cd_xTe (MCT) (x ~ 0.22) has been studied. Samples for the study were fabricated by thermal annealing of n-type heterostructures grown by molecular beam epitaxy (MBE) on GaAs. Their behaviour under ion milling was compared to that of MCT bulk samples and films grown by liquid and vapour phase epitaxy. Residual donor concentration in the MBE-grown structures was found to be of the order of 10~(15) cm~(-3), which is typical for MCT. Unique to the MBE structures was high electron concentration (~10~(17) cm~(-3)) straight after the milling. We suppose that this fact reflected ion-milling-induced activation of an initially neutral defect, which was formed in the heterostructures during the growth. A possible nature of the defect is discussed.
机译:研究了离子铣削对空位和砷掺杂的p-Hg_(1-x)Cd_xTe(MCT)(x〜0.22)的电性能的影响。用于研究的样品是通过对GaAs上的分子束外延(MBE)生长的n型异质结构进行热退火而制成的。将其在离子铣削下的行为与通过液相和气相外延生长的MCT块状样品和薄膜的行为进行了比较。发现MBE生长的结构中的残余供体浓度约为10〜(15)cm〜(-3),这是MCT的典型特征。 MBE结构的独特之处是研磨后直接产生高电子浓度(〜10〜(17)cm〜(-3))。我们认为,这一事实反映了离子铣削引起的初始中性缺陷的激活,该缺陷在生长过程中在异质结构中形成。讨论了缺陷的可能性质。

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