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Single Halo Sdodel N-mosfet: An Alternative Low-cost Pseudo-soi With Better Analog Performance

机译:单个Halo Sdodel N-mosfet:具有更好模拟性能的另一种低成本Pseudo-soi

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In this paper, with the help of extensive TCAD simulations, we investigate the analog performance of source/drain on depletion layer (SDODEL) MOSFETs with a single-halo (SH) implant near the source side of the channel. We use the SH implant in such a structure for the first time. The analog performance parameters in SH SDODEL MOSFETs are compared to those in SH MOSFETs as well as in SH SOI MOSFETs. In addition to reduced junction capacitance for the SH SDODEL structure as compared to that in bulk SH devices, it has been shown that such devices lead to improved performance and lower power dissipation for sub-100 nm CMOS technologies. Our results show that, in SH SDODEL MOSFETs, there is significant improvement in the intrinsic device performance for analog applications (such as device gain, g_m/I_D, etc) for the sub-100 nm technologies.rn(Some figures in this article are in colour only in the electronic version)
机译:在本文中,借助广泛的TCAD模拟,我们研究了在沟道源极附近采用单光晕(SH)注入的耗尽层(SDODEL)MOSFET上源极/漏极的模拟性能。我们首次在这种结构中使用SH植入物。 SH SDODEL MOSFET中的模拟性能参数与SH MOSFET和SH SOI MOSFET中的模拟性能参数进行了比较。与大型SH器件相比,SH SDODEL结构不仅减小了结电容,而且还表明,此类器件可提高性能并降低100纳米以下CMOS技术的功耗。我们的结果表明,在SH SDODEL MOSFET中,对于100 nm以下的技术,模拟应用的固有器件性能(例如器件增益,g_m / I_D等)有了显着改善。仅在电子版本中为彩色)

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