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Characteristics and thermal stability of ruthenium/p-GaAs Schottky contacts

机译:钌/ p-GaAs肖特基接触的特性和热稳定性

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This paper presents evidence that the barrier heights of ruthenium Schottky contacts formed on n- and p-type GaAs are determined by the pinning of the Fermi level by interfacial antisite defects. The surface Fermi level of as-deposited Schottky contacts is believed to be pinned 0.5 eV above the valence band maximum, in agreement with the 0.89 ± 0.06 eV barrier height measured for n-GaAs and the 0.50 ± 0.03 eV barrier height measured for p-GaAs. Annealing of the ruthenium Schottky contacts decreased the batrier height for n-GaAs to 0.75 ± 0.02 eV and increased the barrier height to 0.72 ± 0.06 eV for p-GaAs. These changes in barrier height are attributed to a shift in the Fend-level pinning position towards the conduction band minimum, which is ascribed to an interface reaction that increases the As_Ga.Ga_As ratio. Hydrogenation of the ruthenium Schottky contacts resulted in the neutralization of interface defects, thereby producing barrier heights that are instead determined by the ruthenium work function.
机译:本文提供的证据表明,在n型和p型GaAs上形成的钌肖特基接触的势垒高度取决于界面反位缺陷对费米能级的固定。沉积态肖特基接触的表面费米能级被认为固定在价带最大值之上0.5 eV,这与对n-GaAs测得的0.89±0.06 eV势垒高度和对于p-Ga所测得的0.50±0.03 eV势垒高度一致。砷化镓钌肖特基接触的退火将n-GaAs的势垒高度降低到0.75±0.02 eV,将p-GaAs的势垒高度提高到0.72±0.06 eV。势垒高度的这些变化归因于Fend级钉扎位置向导带最小值的偏移,这归因于增加As_Ga.Ga_As比的界面反应。钌肖特基触点的氢化导致界面缺陷的中和,从而产生了阻挡层高度,该高度由钌功函数决定。

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