Semiconductor Plastic Packaging Materials Market to Reach $20.1 Billion by 2013

摘要

The market for semicon-rnductor packaging materials, including thermal interface materials, is expected to reach $15.8 billion in 2009 and grow to $20.1 billion by 2013, according to a new study by SEMI and TechSearch International. Laminate substrates remain the largest segment of the market, worth an estimated $6.8 billion globally in 2009, and on a unit basis are projected to grow at a compound annual growth rate of almost 8% over the next five years.