Visit ADLINK at the ESC Silicon Valley for Embedded Solutions Based on the Latest Intel(R) Microarchitectures

摘要

ADLINK Technology, Inc., a leading provider of embedded platform products and services, will presentntheir newest products based on the latest Intel? technology at the Embedded Systems ConferencenSilicon Valley from May 3 to 5, 2011 in San Jose, CA. Product highlights include ADLINK's newnembedded platforms which utilize the new Intel? Core? i7/i5/i3 processors, Intel? Q67 chipset andnIntel? QM67 Express chipset in a variety of form factors, such as CompactPCI?, COM Express?,nPICMG? 1.3, ATX and Mini-ITX. These highly-integrated embedded solutions offer customers advancedntechnologies and new levels of computing performance for applications including transportation, military,nmedical, gaming and factory automation. Customers looking for I/O flexibility in embedded applicationsnwill find the solution in ADLINK's new "Ultra" size COM Express? module featuring Intel? Atom?nProcessor E6xx Series, which also come in an Extreme Rugged? version for deployment in harshnenvironments.