Patent Issued for Hidden Parting Line Mold and Hidden Parting Line Molding Technique Using Associated Part Removal Device

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Patent Issued for Hidden Parting Line Mold and Hidden Parting Line Molding Technique Using Associated Part Removal Device

机译：使用相关零件移除装置的隐藏式分型线模具和隐藏式分型线成型技术已获专利

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2013 JAN 21 (VerticalNews) -- By a News Reporter-Staff News Editor at Robotics & Machine Learning -- Honda Motor Co., Ltd. (Tokyo, JP) has been issued patent number 8349240, according to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

机译：2013年1月21日（垂直新闻）-机器人与机器学习新闻记者-工作人员新闻编辑-本田汽车有限公司（日本东京）已获得专利号8349240，据源自亚历山大的新闻报道，由VerticalNews编辑。

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《Robotics and Machine Learning》 |2013年第3期|1-4|共4页
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Robotics, Machine Learning, Honda Motor Co. Ltd., Emerging Technologies.;

机译：机器人技术;机器学习;本田汽车有限公司;新兴技术。;

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专利

1. Researchers Submit Patent Application, "Hidden Parting Line Mold and Hidden Parting Line Molding Technique Using Associated Part Removal Device", for Approval [J] . Robotics and Machine Learning . 2012,第42期

机译：研究人员提交了专利申请“使用相关零件移除装置的隐藏式分型线模具和隐藏式分型线成型技术”以供批准
2. Patent Issued for Mold, Device and Method for Producing Molded Skins and Molded Bodies Made of Plastic [J] . Journal of Engineering . 2013,第12期

机译：生产用于制造塑料模制表皮和模制主体的模具，装置和方法的专利
3. Patent Issued for Mold Goods and Insert Molding Method [J] . Journal of Engineering . 2013,第12期

机译：模具产品和嵌件成型方法已获专利
4. Parallel processing techniques for hidden surface removal [C] . Michael Kaplan, Donald P. Greenberg Annual conference on Computer graphics and interactive techniques;Conference on Computer graphics and interactive techniques . 1979

机译：并行处理技术用于隐藏表面去除
5. The hidden evidence from Hidden Cave, Nevada: An application of immunological techniques to the analysis of archaeological materials [D] . Newman, Margaret Evelyn 1990

机译：内华达州隐藏洞穴的隐藏证据：免疫技术在考古材料分析中的应用
6. Rapid and Low-cost Prototyping of Medical Devices Using 3D Printed Molds for Liquid Injection Molding [O] . Philip Chung, J. Alex Heller, Mozziyar Etemadi, 2014

机译：使用3D打印模具进行液体注射成型的医疗设备快速低成本原型设计
7. An Application of Line-labeling and other Scene-analysis Techniques to the Problem of Hidden-line Removal [O] . Lavin Mark A. 1974

机译：线标法等场景分析技术在隐线去除问题中的应用

Patent Issued for Hidden Parting Line Mold and Hidden Parting Line Molding Technique Using Associated Part Removal Device

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