Alternative approach to a low-cost wideband amplifier

摘要

An alternative approach to the development of a wideband amplifier should take into account the effect of its package and its printed circuit interconnections for accurate analysis of high-frequency and microwave circuits. In this analysis, we have departed from a lumped-element model based on quasi-static approaches, which do not take accurate account of RF current and field distributions in complicated structures, such as package pins and printed circuits containing plated via holes. The objective can then be deduced: If reiteration is to be minimized, the simulation results must match the measured results as accurately as possible. In practice, there are always departures, but each step taken to narrow the gap will yield a benefit.