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FRACTURE MECHANICAL CHARACTERIZATION OF IC-DEVICE INTERFACES

机译:IC设备接口的断裂机械特性

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To characterize the bond-strength or adhesion of the different interfaces in plastic encapsulated ICs a fracture-mechanical test method has been used. For this four-point-bend test a preparation method has been developed to get the four-point-bend test samples out of the moulded IC devices. The measurement of the adhesion along the main phase boundaries of plastic encapsulated devices before and after stress-tests (HAST, pressure-cooker, solder dips, temperature cycles) was done also to characterize the change in bond-strength during those tests. A mechanical model is presented which helps to describe the PC-specific corrosion phenomena as well as failures resulting from temperature cycle tests.
机译:为了表征塑料封装的IC中不同界面的结合强度或粘附力,已使用了断裂力学测试方法。对于这种四点弯曲测试,已经开发了一种制备方法,用于从模制IC器件中取出四点弯曲测试样品。在进行压力测试(HAST,压力锅,焊料浸入,温度循环)之前和之后,还测量了沿塑料封装器件的主要相边界的粘附力,以表征这些测试过程中粘结强度的变化。提出了一个机械模型,该机械模型有助于描述特定于PC的腐蚀现象以及温度循环测试导致的故障。

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