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FREQUENCY DEPENDENCE OF DEGRADATION AND BREAKDOWN OF THIN SiO_2 FILMS

机译:薄SiO_2薄膜的降解和破裂的频率依赖性。

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Thin oxide MOS capacitors are subjected to bipolar voltage stresses of different amplitudes and frequencies. According to a previously proposed breakdown model, the evolution of the current with the stress time has been considered to be due to the degradation of the oxide, i.e. to the generation and partial occupation of electron traps. When log(J) is represented versus the stress time, the slope of the plot and the magnitude of the current (which tends to decrease during constant-voltage tests) are taken as indicators of the oxide degradation rate and degradation level, respectively. Our results suggest lower degradation rates, and consequently lower degradation levels for the same stress times, at high frequencies. This is consistent with the increase of time-to-breakdown with stress frequency observed by other authors, and confirms that, also for dynamic stresses, the relation between degradation and breakdown is fundamental to understand the physics of these phenomena. The slower degradation rates confirm the improvement of oxide reliability under dynamic AC stress conditions.
机译:薄氧化物MOS电容器承受不同幅度和频率的双极性电压应力。根据先前提出的击穿模型,电流随应力时间的演变被认为是由于氧化物的降解,即由于电子陷阱的产生和部分占据。当用log(J)表示应力时间时,曲线的斜率和电流的大小(在恒定电压测试中趋于减小)分别用作氧化物降解速率和降解水平的指标。我们的结果表明,在较高的频率下,在相同的应力时间下,降解率较低,因此降解水平较低。这与其他作者观察到的随着应力频率的击穿时间的增加是一致的,并且证实,对于动态应力而言,退化与击穿之间的关系对于理解这些现象的物理性质也是至关重要的。较慢的降解速率证实了在动态AC应力条件下氧化物可靠性的提高。

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