LASER PROBE MEASUREMENTS OF QUALITY EVOLUTION OF SOLDER JOINTS DURING THERMAL CYCLING AGEING TESTS

摘要

We present the results of a non-destructive measuring method allowing us to characterize the evolution of solder joints during thermal cycling ageing tests. The method uses a high resolution optical probe to detect selectively pure Joule and Peltier thermal responses of the solder joint subject to a given current pulse. The results show the Peltier and Joule responses to be good indicators for the evaluation of the age and the degradation of solder joints.