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首页> 外文期刊>Power Electronics, IET >SiC trench MOSFET with heterojunction diode for low switching loss and high short-circuit capability
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SiC trench MOSFET with heterojunction diode for low switching loss and high short-circuit capability

机译:具有异质结二极管的SiC沟槽MOSFET具有低开关损耗和高短路能力

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摘要

A SiC trench MOSFET with a merged heterojunction diode is proposed and numerically analysed here. The merged heterojunction diode can effectively suppress the turn-on of the parasitic body diode in the proposed SiC trench MOSFET. In addition, a P + shield layer surrounding the gate oxide layer can dramatically alleviate the gate oxide corner from the concentration of the electric field and improve the static and dynamic performances of the proposed device. As a result, not only the breakdown voltage is increased by 24% but also the miller charge and the switching losses of the proposed structure are reduced by 43 and 48.6%, respectively, when compared with those of the conventional SiC trench MOSFET with a grounded P + shield layer. Moreover, the short-circuit capability and its failure mechanism are numerically studied for the proposed structure. Finally, a feasible fabrication procedure is provided to realise the fabrication of this new device.
机译:提出了带有合并异质结二极管的SiC沟槽MOSFET,并在此进行了数值分析。合并的异质结二极管可以有效地抑制拟议的SiC沟槽MOSFET中寄生体二极管的导通。另外,围绕栅氧化物层的P +屏蔽层可以从电场集中显着减轻栅氧化物角,并改善所提出器件的静态和动态性能。结果,与具有接地的传统SiC沟槽MOSFET相比,不仅击穿电压提高了24%,而且米勒电荷和拟议结构的开关损耗分别降低了43%和48.6%。 P +屏蔽层。此外,对所提出的结构的短路能力及其破坏机理进行了数值研究。最后,提供了可行的制造过程以实现该新器件的制造。

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