Preparation of Diamond-like Carbon Film Assisted in the Plasma of Dielectric Barrier Discharge at Atmoshperic Pressure

摘要

Dielectric barrier discharge at atmospheric presure has been applied to prepare hydrocarbon films on large- area glass and silicon substrates. When hydrogen and methane mixture (2:1) is used as dischrge gas and the substrate is heated to 300 deg C, hard hydrogenated amorhous carbon film is deposited. Fromt he IR decomvoution analysis of the C-H stretching absorptionf or thue coating, the hydrocarbon group ratio (CH_3:CH_2:CH) and C-C bond type ratio (sp~3 c/sp~2 c) are about 10/100: 21/100:69/100 and 3:1～6:1, respectiely. Their Knoop hardness is up to 10Gpa. No film isdeposited when the content of methane in the mixed gases is decreased to 5/100 at 300 deg C silicon substrate.