...
机译:不同氧分压下烧结的Ag / Ni复合带中Bi-2223的晶粒长大
College of Materials Science and Engineering, Chongqing University, Chongqing 400044, P.R. China;
College of Materials Science and Engineering, Chongqing University, Chongqing 400044, P.R. China;
College of Materials Science and Engineering, Chongqing University, Chongqing 400044, P.R. China;
College of Materials Science and Engineering, Chongqing University, Chongqing 400044, P.R. China;
College of Materials Science and Engineering, Chongqing University, Chongqing 400044, P.R. China;
ceramics; cuprate superconductors; grains; growth; tapes;
机译:烧结条件对Bi-2223 / Ag / Ni复合护套带相形成和组织的影响
机译:Ag / Ni复合带中(Bi,Pb)_2Sr_2Ca_2Cu_3O_(10)晶粒的生长动力学研究
机译:Ag / Ni复合带中Bi-2223相的不均匀分布研究
机译:烧结条件对Bi-2223 / Ag / Ni复合护套带相形成和组织的影响
机译:植株年龄影响对总压和氧气分压降低的长期生长响应。
机译:烧结温度对锂镍锌铁氧体晶粒长大组织和磁性的影响
机译:氧分压在烧结气氛中的影响在Ag-Seathed Bi22223带的微观结构上
机译:使用细粒Bi-2223作为前体制备的ag / Bi-2223复合导体中的相稳定性和晶粒生长。