Intel introduces chipsets for wireless-broadband devices

摘要

Last week at the Intel Developer Forum (IDF) in Shanghai, Intel announced that it was shipping new chipsets for small-form-factor wireless-broadband Internet devices, saying the first commercial products to use the components will be on the market in late May. At the same time, the company said it remained fully committed to WiMAX but acknowledged that there was uncertainty in some markets about the technology.